Specific Process Knowledge/Back-end processing/Wire Bonder: Difference between revisions
mNo edit summary |
|||
| Line 53: | Line 53: | ||
*Manual operation | *Manual operation | ||
*Wedge bonding: | *Wedge bonding: | ||
**recommended min. bonding area 200 µm | **recommended min. bonding area 200 µm x 200 µm | ||
*Ball bonding: | *Ball bonding: | ||
**recommended min. bonding area 200 µm | **recommended min. bonding area 200 µm x 200 µm | ||
**recommended temperature 120 <sup>o</sup>C. | **recommended temperature 120 <sup>o</sup>C. | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||