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Specific Process Knowledge/Lithography/Coaters: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
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Taran (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
3,526 edits
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*Post-exposure baking at 110°C
*Post-exposure baking at 110°C
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*Coating and baking of
*In-line substrate HMDS priming
**AZ5214E
*Coating and baking of  
**AZ4562
**AR-P 6200 (CSAR)
**E-beam resist (for batches > 25 wafers)
**AZ 5214E
**AZ MiR 701 (29cps)
**AZ 4562
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|style="background:WhiteSmoke; color:black"|
*Coating of
*Coating of
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* Cassette-to-cassette  
* Cassette-to-cassette  
* Edge handling chuck
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|style="background:WhiteSmoke; color:black"|
* Single substrate
* Single substrate
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