Jump to content

Specific Process Knowledge/Lithography/Coaters: Difference between revisions

← Older editNewer edit →
VisualWikitext
Taran (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
3,531 edits
Taran (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
3,531 edits
Line 483: Line 483:


''[[Specific_Process_Knowledge/Lithography/Coaters#Coater_Comparison_Table|Coater comparison table]]''
''[[Specific_Process_Knowledge/Lithography/Coaters#Coater_Comparison_Table|Coater comparison table]]''
Spin Coater: Gamma E-beam and UV will be installed at Danchip in June 2017. It is a Gamma 4M cluster from Süss MicroTec with spin coating, vapour priming, and baking modules. The system handles 2", 4", and 6" wafers without size conversion, using two separate coater stations.


==Spin Coater: RCD8==
==Spin Coater: RCD8==
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Lithography/Coaters"