Specific Process Knowledge/Thermal Process/C4 Aluminium Anneal furnace: Difference between revisions
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*Silicon wafers with aluminium. | *Silicon wafers with aluminium. | ||
Silicon wafers with ALD oxides Al2O3 and TiO2 | |||
*Wafers are allowed enter the furnace after aluminium lift-off or after aluminium etch and resist strip in acetone | *Wafers are allowed enter the furnace after aluminium lift-off or after aluminium etch and resist strip in acetone | ||
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