Specific Process Knowledge/Etch/KOH Etch: Difference between revisions
| Line 111: | Line 111: | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*Etch of Silicon in 28 wt% KOH | *Etch of Silicon in 28 wt% KOH | ||
|style="background:WhiteSmoke; color:black"| | |||
*Etch of Silicon in 28 wt% KOH | |||
The bath is dedicated wafer with electroplated Nickel or otherwise dirty wafers | The bath is dedicated wafer with electroplated Nickel or otherwise dirty wafers | ||
|- | |- | ||
|style="background:LightGrey; color:black"|Link to safety APV and KBA | |style="background:LightGrey; color:black"|Link to safety APV and KBA | ||