Specific Process Knowledge/Etch/Wet Silicon Oxide Etch (BHF): Difference between revisions
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Wafers with metals or other materials, not allowed in the dedicated oxide etch baths, can be etched in the PP-bath positioned in the fume hood in cleanroom 2 or in a '''plastic''' beaker. | Wafers with metals or other materials, not allowed in the dedicated oxide etch baths, can be etched in the PP-bath positioned in the fume hood in cleanroom 2 or in a '''plastic''' beaker. | ||
'''The user manual for | '''The user manual for Oxide etch 1: BHF, APV's and contact information can be found in LabManager''' [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=389 by clicking here] | ||
'''The user manual for Oxide etch 2: BHF (clean), APV's and contact information can be found in LabManager''' [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=378 by clicking here] | |||
'''The user manual for HF bath in RCA and Fume hood in B-1, APV's and contact information can be found in LabManager''' [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=64 by clicking here] | |||
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