Specific Process Knowledge/Etch/KOH Etch: Difference between revisions
| Line 40: | Line 40: | ||
|- | |- | ||
| | | | ||
*[http://labmanager.danchip.dtu.dk/d4Show.php?id=3203&mach=9 The QC procedure for | *[http://labmanager.danchip.dtu.dk/d4Show.php?id=3203&mach=9 The QC procedure for Si Etch: 01]<br> | ||
*[http://labmanager.danchip.dtu.dk/d4Show.php?id=1565&mach=248 The QC procedure for | *[http://labmanager.danchip.dtu.dk/d4Show.php?id=1565&mach=248 The QC procedure for Si Etch: 01]<br> | ||
*[http://labmanager.danchip.dtu.dk/view_binary.php?type=data&mach=9 The newest QC data for KOH1]<br> | *[http://labmanager.danchip.dtu.dk/view_binary.php?type=data&mach=9 The newest QC data for KOH1]<br> | ||
*[http://labmanager.danchip.dtu.dk/view_binary.php?type=data&mach=49 The newest QC data for KOH2]<br> | *[http://labmanager.danchip.dtu.dk/view_binary.php?type=data&mach=49 The newest QC data for KOH2]<br> | ||