Specific Process Knowledge/Thin film deposition: Difference between revisions
| Line 70: | Line 70: | ||
*[[/Alcatel|Alcatel]] - ''E-beam evaporator and sputter tool'' | *[[/Alcatel|Alcatel]] - ''E-beam evaporator and sputter tool'' | ||
*[[/Lesker|Lesker]] - ''Sputter tool'' | *[[/Lesker|Lesker]] - ''Sputter tool'' | ||
*[[/Leybold|Leybold]] - ''E-beam evaporator and multiple wafer tool'' | *[[/Leybold|Leybold]] - ''E-beam evaporator and multiple wafer tool'' | ||
*[[/Wordentec|Wordentec]] - ''E-beam evaporator, sputter and | *[[/Wordentec|Wordentec]] - ''E-beam evaporator, sputter and thermal evaporator'' | ||
*[[/Hummer|Hummer]] - ''Gold sputtering system'' | *[[/Hummer|Hummer]] - ''Gold sputtering system'' | ||
*[[/PECVD|PECVD]] - ''Plasma Enhanced Chemical Vapor deposition'' | *[[/PECVD|PECVD]] - ''Plasma Enhanced Chemical Vapor deposition'' | ||
*[[/B2 Furnace LPCVD Nitride|B2 Furnace LPCVD Nitride]] - ''Deposition of silicon | *[[/Furnace LPCVD Nitride (6")|Furnace LPCVD Nitride (6")]] - ''Deposition of silicon nitride'' | ||
*[[/B3 Furnace LPCVD TEOS|B3 Furnace LPCVD TEOS]] - ''Deposition of silicon oxide'' | *[[/B2 Furnace LPCVD Nitride|B2 Furnace LPCVD Nitride]] - ''Deposition of silicon nitride'' | ||
*[[/B4 Furnace LPCVD PolySilicon|B4 Furnace LPCVD PolySilicon]] - ''Deposition of polysilicon'' | *[[/B3 Furnace LPCVD TEOS|B3 Furnace LPCVD TEOS]] - ''Deposition of silicon oxide'' | ||
*[[/B4 Furnace LPCVD PolySilicon|B4 Furnace LPCVD PolySilicon]] - ''Deposition of polysilicon'' | |||
*[[/MVD|MVD]] - ''Molecular Vapor Deposition'' | *[[/MVD|MVD]] - ''Molecular Vapor Deposition'' | ||