Specific Process Knowledge/Etch/Wet Silicon Oxide Etch (BHF): Difference between revisions
| Line 167: | Line 167: | ||
|1-25 wafers at a time | |1-25 wafers at a time | ||
|1-25 wafer at a time | |1-25 wafer at a time | ||
|1-25 wafers at a time | |1-25 wafers at a time | ||
|1-25 wafers at a time | |1-25 wafers at a time | ||
| Line 175: | Line 174: | ||
|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
!Size of substrate | !Size of substrate | ||
|2"-6" wafers | |2"-6" wafers | ||
|2"-6" wafers | |2"-6" wafers | ||