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Specific Process Knowledge/Back-end processing/Disco Saw: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891, Bureaucrats, danchip, Administrators
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Jehan (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891, Bureaucrats, danchip, Administrators
1,093 edits
Line 102: Line 102:
|-valign="top"
|-valign="top"
|'''Recommended dice depth'''
|'''Recommended dice depth'''
|Leave 200 µm uncut(preferred).<br> It is possible to cut through the sample.
|Set blade height to 200µm (preferred). This leaves 125µm uncut since blue tape is 75µm.<br> It is possible to cut through the sample.
|Leave 200 µm uncut (preferred). <br> It is possible to cut through the sample.
|Set blade height to 200µm (preferred). This leaves 125µm uncut since blue tape is 75µm.<br> It is possible to cut through the sample.
|-valign="top"
|-valign="top"
|'''Max. sample thickness'''
|'''Max. sample thickness'''
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