Specific Process Knowledge/Thin film deposition/ALD2 (PEALD): Difference between revisions

@@ Line 117: / Line 117: @@
 |style="background:LightGrey; color:black"|Batch size
 |style="background:WhiteSmoke; color:black"|
+*Smaller samples - Loaded on a 150 mm carrier plate or dummy wafer with an etched recess through the load lock
+*One 100 mm wafer - Loaded on a 150 mm carrier plate or dummy wafer with an etched recess through the load lock
+*One 150 mm wafer - Loaded directly through the loadlock
 *One 200 mm wafer - Loaded directly through the loadlock
-*One 150 mm wafer - Loaded directly through the loadlock
+*For thermal ALD depositions of oxides, there is room for up to five wafers. 100, 150 and 200 mm wafers have to be loaded directly into the ALD chamber
-*One 100 mm wafer - Loaded on a 150 mm carrier plate or dummy wafer with an etched recess through the load lock
-*Smaller samples - Loaded on a 150 mm carrier plate or dummy wafer with an etched recess through the load lock
-*For deposition of thermal oxide up to five 200, 150 or 100 mm wafers can be loaded directly in the ALD chamber
 |-
 | style="background:LightGrey; color:black"|Allowed materials