Specific Process Knowledge/Thin film deposition/ALD2 (PEALD): Difference between revisions
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== Thermal ALD and PEALD == | == Thermal ALD and PEALD == | ||
[[image:ALD2.jpg| | [[image:ALD2.jpg|400x400px|right|thumb|ALD 2 (PEALD), positioned in cleanroom F-2.]] | ||
The ALD 2 (PEALD) is used to deposit very thin and uniform layers of different materials, by use of thermal ALD or PEALD (Plasma Enhanced Atomic Layer Deposition). | The ALD 2 (PEALD) is used to deposit very thin and uniform layers of different materials, by use of thermal ALD or PEALD (Plasma Enhanced Atomic Layer Deposition). | ||
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[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=365 ALD 2 (PEALD) info page in LabManager] | [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=365 ALD 2 (PEALD) info page in LabManager] | ||
== Process information == | == Process information == | ||