Specific Process Knowledge/Thin film deposition/ALD2 (PEALD): Difference between revisions
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The ALD is controlled by use of a computer with a touch screen that is situated next to the machine. | The ALD is controlled by use of a computer with a touch screen that is situated next to the machine. | ||
The ALD 2 (PEALD) is a Picosun R-200 Advanced Plasma ALD manufactured by Picosun, and it was installed in the cleanroom in 2016. | The ALD 2 (PEALD) is a Picosun R-200 Advanced Plasma ALD manufactured by Picosun, and it was installed in the cleanroom in 2016. | ||
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[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=365 ALD 2 (PEALD) info page in LabManager] | [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=365 ALD 2 (PEALD) info page in LabManager] | ||
== Process information == | == Process information == | ||
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*One 100 mm wafer - Loaded on a 150 mm carrier plate or dummy wafer with an etched recess through the load lock | *One 100 mm wafer - Loaded on a 150 mm carrier plate or dummy wafer with an etched recess through the load lock | ||
*Smaller samples - Loaded on a 150 mm carrier plate or dummy wafer with an etched recess through the load lock | *Smaller samples - Loaded on a 150 mm carrier plate or dummy wafer with an etched recess through the load lock | ||
*For deposition of thermal oxide up to five wafers can be loaded directly in the ALD chamber | *For deposition of thermal oxide up to five 200, 150 or 100 mm wafers can be loaded directly in the ALD chamber | ||
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| style="background:LightGrey; color:black"|Allowed materials | | style="background:LightGrey; color:black"|Allowed materials | ||