Jump to content

Specific Process Knowledge/Characterization/Topographic measurement: Difference between revisions

Bghe (talk | contribs)
No edit summary
Bghe (talk | contribs)
Line 33: Line 33:
|Profiler for measuring micro structures. Can do wafer mapping and stress measurements.
|Profiler for measuring micro structures. Can do wafer mapping and stress measurements.
|Profiler for measuring micro structures. Can do wafer mapping and stress measurements.
|Profiler for measuring micro structures. Can do wafer mapping and stress measurements.
|3D Profiler for measuring micro structures. Can do wafer mapping.
|3D Profiler for measuring micro structures and surface roughness. Can do wafer mapping.
|AFM for measuring nanostructures and surface roughness
|AFM for measuring nanostructures and surface roughness
|Profiler for measuring micro structures.
|Profiler for measuring micro structures.