Specific Process Knowledge/Etch/Etching of Bulk Glass: Difference between revisions
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Etching of glass can be done either wet or dry. Wet etching is done with HF. Dry etching can be done either with [[Specific Process Knowledge/Etch/AOE (Advanced Oxide Etch)|AOE]] using Flourine chemistry (only fused silica) or with [[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE]] by sputtering with Ar ions and/or using flourine chemistry. | Etching of glass can be done either wet or dry. Wet etching is done with HF. Dry etching can be done either with [[Specific Process Knowledge/Etch/AOE (Advanced Oxide Etch)|AOE]] using Flourine chemistry (only fused silica) or with [[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE]] by sputtering with Ar ions and/or using flourine chemistry. | ||
At Danchip, we have two types of bulk glass substrates: Borosilicate glass (Borofloat 33 (like pyrex)) and fused silica glass which in cleanliness is similar to quartz. Both types are etched wet in a special set-up placed in a fumehood using a | At Danchip, we have two types of bulk glass substrates: Borosilicate glass (Borofloat 33 (like pyrex)) and fused silica glass which in cleanliness is similar to quartz. Both types are etched wet in a special set-up placed in a fumehood using a concentrated HF-solution (isotropic etch). | ||
The set-up consists of a 5L plasic beaker placed on a stirring plate (magnetic stirring) and a special horizontal wafer holder. Normally a 40% pre-mixed HF solution is used. | The set-up consists of a 5L plasic beaker placed on a stirring plate (magnetic stirring) and a special horizontal wafer holder. Normally a 40% pre-mixed HF solution is used. | ||