Specific Process Knowledge/Etch/Aluminum Oxide/Al2O3 Etch with ICP Metal: Difference between revisions
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*'''~ | *'''~93nm/min (30s, 1/4 wafer on 6" carrier)'''<br> ''2017-01-20 bghe@danchip'' | ||
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Bghe (talk | contribs) DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, Bureaucrats, Administrators 7,317 edits |
Bghe (talk | contribs) DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, Bureaucrats, Administrators 7,317 edits |
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| Line 39: | Line 39: | ||
|Al2O3 | |Al2O3 | ||
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*'''~ | *'''~93nm/min (30s, 1/4 wafer on 6" carrier)'''<br> ''2017-01-20 bghe@danchip'' | ||
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