Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange/ProcessD/PrD02: Difference between revisions

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Jmli (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
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<!--Checked for updates on 11/2-2019 - ok/jmli -->
{| border="2" cellpadding="0" cellspacing="0" style="text-align:center;"
{| border="2" cellpadding="0" cellspacing="0" style="text-align:center;"
|+ '''Process runs'''
|+ '''Process runs'''

Revision as of 12:36, 11 February 2019

Process runs
Date Substrate Information Process Information SEM Images
Wafer info Mask Material/ Exposed area Tool / Operator Conditioning Recipe Wafer ID Comments
2/12-2014 4" Wafer with travka50 mask AZ standard Si / 50 % Pegasus/jmli 10 minute TDESC clean danchip/jml/showerhead/prD/PrD02, 110 cyc or 6:25 mins S004693 New showerhead

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