Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange/ProcessD/NewProcessD: Difference between revisions
No edit summary |
No edit summary |
||
Line 1: | Line 1: | ||
<!--Checked for updates on 11/2-2019 - ok/jmli --> | |||
{| border="2" cellpadding="0" cellspacing="0" style="text-align:center;" | {| border="2" cellpadding="0" cellspacing="0" style="text-align:center;" | ||
|+ '''Process runs''' | |+ '''Process runs''' |
Revision as of 11:36, 11 February 2019
Date | Substrate Information | Process Information | SEM Images | ||||||
---|---|---|---|---|---|---|---|---|---|
Wafer info | Mask | Material/ Exposed area | Tool / Operator | Conditioning | Recipe | Wafer ID | Comments | ||
15/12-2014 | 4" Wafer with AZ resist | Travka50 pattern | Si / 50 % | Pegasus/jmli | 20 minute TDESC clean | danchip/jml/showerhead/prD/New Process D, 75 cycles or 5:00 minutes | S004743 | New showerhead |