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Specific Process Knowledge/Thin film deposition/MVD: Difference between revisions

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The Applied Microstructures MVD 100 system deposits molecular films on surfaces. These films serve a wide range of purposes ranging from antistiction coatings of nanoimprint lithography stamps to protecting MEMS structures. They are created as self-assembled monolayers on a surface when a molecular vapor of chemials is present. In most cases the chlorine atoms in the end of an flourinated organosilane react with -OH groups of the surface to form a chemical bond under elimination of HCL.
The Applied Microstructures MVD 100 system deposits molecular films on surfaces. These films serve a wide range of purposes ranging from antistiction coatings of nanoimprint lithography stamps to protecting MEMS structures. They are created as self-assembled monolayers on a surface when a molecular vapor of chemials is present. In most cases the chlorine atoms in the end of an flourinated organosilane react with -OH groups of the surface to form a chemical bond under elimination of HCL.


{| border="2" cellpadding="2" cellspacing="1"
|+ The shallolr recipe
|-
! colspan="2" align="center"| Common parameters
! Flow
! Power
! Time
|-
! colspan="3" align="center"| Multiplexed parameters
|-
! Parameter 
! Setting
! Parameter
! Etch
! Passivation
|-
! Temperature
| 10<sup>o</sup>C
! SF<sub>6</sub> Flow
| 260 sccm
| 0 sccm
|-
! No. of cycles
| 31
! O<sub>2</sub> Flow
| 26 sccm
| 0 sccm
|-
! Process time
| 5:56 mins
! C<sub>4</sub>F<sub>4</sub> Flow
| 0 sccm
| 120 sccm
|-
! APC mode
| manual
! RF coil
| 2800 W
| 1000 W
|-
! APC setting
| 86.8 %
! RF Platen
| 16 W
| 0 W
|-
!
|
! Cycle time
| 6.5 s
| 5 s
|}




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|-
|-
! rowspan="3" align="center"| O<sub>2</sub> plasma
! rowspan="3" align="center"| O<sub>2</sub> plasma
! Flow
! Power
! Time
| 200 sccm
| 250 Watts
| 300 seconds
|-
! rowspan="3" align="center"| Chemical # 1 (vapor order 1)
! rowspan="3" align="center"| Chemical # 1 (vapor order 1)
! rowspan="3" align="center"| Chemical # 2 (vapor order 2)
! rowspan="3" align="center"| Chemical # 2 (vapor order 2)
! Processing  
! Processing  
|-
! Flow
! Setting
! Parameter
! Etch
! Passivation
|-
|-
! Temperature  
! Temperature  
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| 26 sccm
| 26 sccm
| 0 sccm
| 0 sccm
|-
 
! Process time
| 5:56 mins
! C<sub>4</sub>F<sub>4</sub> Flow
| 0 sccm
| 120 sccm
|-
! APC mode
| manual
! RF coil
| 2800 W
| 1000 W
|-
! APC setting
| 86.8 %
! RF Platen
| 16 W
| 0 W
|-
!
|
! Cycle time
| 6.5 s
| 5 s
|}
|}
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