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Taran (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
3,528 edits
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!width="16%"| [[Specific Process Knowledge/Lithography/EBeamLithography|E-beam Lithography]]
!width="16%"| [[Specific Process Knowledge/Lithography/EBeamLithography|E-beam Lithography]]
!width="16%"| [[Specific Process Knowledge/Lithography/NanoImprintLithography|Nano Imprint Lithography]]  
!width="16%"| [[Specific Process Knowledge/Lithography/NanoImprintLithography|Nano Imprint Lithography]]  
!width="16%"| [[Specific Process Knowledge/Lithography/3DLithography|2-Photon Polymerization Lithography]] [[Image:section under construction.jpg|70px]]
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|Patterning by electron beam
|Patterning by electron beam
|Pattern transfer via hot embossing(HE)
|Pattern transfer via hot embossing(HE)
|Direct writing via IR laser
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|-


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*~20 nm and up
*~20 nm and up
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*3D voxel through transparent substrate: 0.3 µm diameter; 0.6 µm high
*2D spot on opaque substrate: 0.6 µm diameter
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|-


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**Topas
**Topas
**PMMA
**PMMA
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*UV sensitive:
**IP photoresists, SU-8 (3D)
**AZ resists (2D)
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|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
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~ 100nm to 2µm
~ 100nm to 2µm
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droplet or coating
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Process depended, depends also on heating and cooling temperature rates
Process depended, depends also on heating and cooling temperature rates
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Process depended, depends on pattern and dose
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*50 mm wafers
*50 mm wafers
*100 mm wafers
*100 mm wafers
*150 mm wafers  
*150 mm wafers
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*Cover slides
*50 mm wafers
*100 mm wafers
*IBIDI
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|-
|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
!'''Allowed materials'''
!'''Allowed materials'''
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*Any standard cleanroom material
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*Any standard cleanroom material  
*Any standard cleanroom material  

Revision as of 10:36, 23 January 2017


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Comparing lithography methods at DTU Danchip

UV Lithography DUV Stepper Lithography E-beam Lithography Nano Imprint Lithography
Generel description Pattern transfer via UltraViolet (UV) light Pattern transfer via DeepUltraViolet (DUV) light Patterning by electron beam Pattern transfer via hot embossing(HE)
Pattern size range
  • ~1.25 µm and up
  • pattern type, shape and pitch dependent
  • ~200 nm and up
  • ~12 nm - 1 µm
  • ~20 nm and up
Resist type
  • UV sensitive:
    • AZ 5214E, AZ 4562, AZ MiR 701 (positive)
    • AZ 5214E, AZ nLOF 2020, SU-8 (negative)
  • DUV sensitive
    • JSR KRF M230Y, JSR KRF M35G (positive)
    • UVN2300-0.8 (negative)
  • E-beam sensitive
    • AR-P6200 CSAR, ZEP502A , PMMA, HSQ, mr-EBL, AR-N 7520
  • Imprint polymers:
    • Topas
    • PMMA
Resist thickness range

~0.5µm to 20µm

~50nm to 2µm

~30nm to 0.5 µm

~ 100nm to 2µm

Typical exposure time

2s-30s pr. wafer

Process depended, depends on pattern, pattern area and dose

Depends on dose, Q [µC/cm2], beam current, I [A], and pattern area, A [cm2]: t = Q*A/I

Process depended, depends also on heating and cooling temperature rates

Substrate size
  • small samples
  • 50 mm wafers
  • 100 mm wafers
  • 150 mm wafers
  • 100 mm wafers
  • 150 mm wafers
  • 200 mm wafers

We have cassettes that fit to

  • 4 small samples (20mm, 12mm, 8mm, 4mm)
  • 6 wafers of 50 mm in size
  • 3 wafers of 100 mm in size
  • 1 wafer of 150 mm in size

Only one cassette can be loaded at time

  • small samples
  • 50 mm wafers
  • 100 mm wafers
  • 150 mm wafers
Allowed materials
  • Any standard cleanroom material
  • Any standard cleanroom material
  • Any standard cleanroom material
  • Any standard cleanroom material


Equipment Pages

Pretreatment

Coaters

Baking

UV Exposure

Deep-UV Exposure

Electron Beam Exposure

Development

Strip

Lift-off

NanoImprint Lithography

3D Lithography


Lithography Tool Package Training

DTU Danchip offers a Tool Package Training in Lithography; the course includes theory on lithographic processes and equipments, as well as training in equipment operation and processing in the cleanroom.

The course is for all users that intend to perform any kind of lithographic processing in the cleanroom.


Lithography Tool Package Training
Schedule
  • Lecture once a month (~3.5 hours). NEXT LECTURE: Starting February 2017 (Week 06), the lecture will be replaced by videos and a short "questions and exercises" session. More info will come later this month.
  • Training session once a week, max. 4 persons per session (9:00 - 14:00). NEXT SESSIONS: 11th of January, 25th of January
Location Seminar room bulding 347 at DTU Danchip and in cleanroom facilities at DTU Danchip
Qualified Prerequisites
  • Cleanroom safety course at DTU Danchip
  • Wet Chemistry Course at DTU Danchip (Lab-Intro)
Preparations

Before the lecture

  • Read Sami Franssila "Introduction to Microfabrication" (2010), Chapter 9: Optical Lithography. (Available online from DTU campus, see link below)
  • Optional but recommended: Watch the training videos (training videos can be found below).

Before training session

  • Watch the training videos of spin coating (automatic), exposure (operation and alignment), and development (automatic). The training videos can be found below.
  • Study the equipment manuals. The manuals are available in LabManager.
  • Study the TPT process flows (first print and alignment). The process flows can be found below.
Course Responsible

The Lithography Group at DTU Danchip: sign up for the course by e-mailing to lithography@danchip.dtu.dk.

Learning Objectives
  • Describe fundamental parts of lithographic processing in a cleanroom, design of process flows
  • Authorization to use spin coater, mask aligner, and developer at DTU Danchip
  • Calculate relevant process parameters
  • Analyze and apply your results of lithographic processing



Knowledge and Information about Lithography

Literature


July TPT lecture


Training videos

Manuals


Process Flows


Slides from Lecture

Resists


UV Exposure


Electron Beam Exposure


Deep-UV Exposure


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