Specific Process Knowledge/Lithography: Difference between revisions
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!width="16%"| [[Specific Process Knowledge/Lithography/EBeamLithography|E-beam Lithography]] | !width="16%"| [[Specific Process Knowledge/Lithography/EBeamLithography|E-beam Lithography]] | ||
!width="16%"| [[Specific Process Knowledge/Lithography/NanoImprintLithography|Nano Imprint Lithography]] | !width="16%"| [[Specific Process Knowledge/Lithography/NanoImprintLithography|Nano Imprint Lithography]] | ||
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|Patterning by electron beam | |Patterning by electron beam | ||
|Pattern transfer via hot embossing(HE) | |Pattern transfer via hot embossing(HE) | ||
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*~20 nm and up | *~20 nm and up | ||
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**Topas | **Topas | ||
**PMMA | **PMMA | ||
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|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
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~ 100nm to 2µm | ~ 100nm to 2µm | ||
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Process depended, depends also on heating and cooling temperature rates | Process depended, depends also on heating and cooling temperature rates | ||
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*50 mm wafers | *50 mm wafers | ||
*100 mm wafers | *100 mm wafers | ||
*150 mm wafers | *150 mm wafers | ||
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|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
!'''Allowed materials''' | !'''Allowed materials''' | ||
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*Any standard cleanroom material | *Any standard cleanroom material | ||