Specific Process Knowledge/Thin film deposition/Deposition of NiV: Difference between revisions
| Line 104: | Line 104: | ||
! Comment | ! Comment | ||
| *Sputter target with NiV composition: Ni/V 93/7% | | | ||
*Sputter target with NiV composition: Ni/V 93/7% | |||
*Substrate rotation | *Substrate rotation | ||
*Substrate RF Bias (optional) | *Substrate RF Bias (optional) | ||
| *Sputter target with NiV composition: Ni/V 93/7% | | | ||
*Sputter target with NiV composition: Ni/V 93/7% | |||
*No substrate rotation | *No substrate rotation | ||
*No substrate RF Bias | *No substrate RF Bias | ||