Specific Process Knowledge/Back-end processing: Difference between revisions
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== Choose an equipment == | == Choose an equipment == | ||
* Substrate/chip/die cleaning | |||
**[[/Packlab Plasma Asher Pico 2|Packlab Plasma Asher Pico 2]] | |||
* Chip/die mounting | * Chip/die mounting | ||
**[[/Die Bonder|Die Bonder (eutectic metal)]] | **[[/Die Bonder|Die Bonder (eutectic metal)]] | ||