Specific Process Knowledge/Back-end processing/Polishing machine: Difference between revisions

Revision as of 10:54, 29 November 2018

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The Logitech Orbis Polisher (CMP) is for polishing wafers (removing material in the nm range) it is not for thinning down wafers or other substrates.

The user manual, user APV, technical information and contact information can be found in LabManager:

Equipment		Polisher/Lapper
Purpose	Thinning of substrates of	InP GaAs Silicon Metals Glass/Quartz
Performance	Thinning	Removal rate: 1-10µm/min Thickness accuracy: +/- 10 µm Thickness homogeneity: +/- 10 µm Roughness: +/- ? µm
Performance	Polishing	Removal rate: ~1 µm/min Thickness accuracy: ? µm Thickness homogeneity: ? µm Roughness: +/- ? µm
Process parameter range	Polishing liquid	Al2O3 (alumina) powder: 3, 9 or 20 µm Chemlox (for polishing) SF1 Polishing Fluid (for polishing e.g. SiO2)
	Polishing cloths	Chemcloth Polishing Cloths (for use with SF1 liquid)
	Rotation speed	Thinning: 5-20 rpm Polishing: 5-80 rpm
	Arm sweep	Thinning: stationary Polishing: 12% (inner) - 80% (outer)
Substrates	Batch size	# small samples one 50 mm wafer one 100 mm wafer
	Allowed materials	InP GaAs Silicon Metals Glass/Quartz

Revision as of 14:01, 19 September 2016 view source Jehan (talk \| contribs) DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891, Bureaucrats, danchip, Administrators 1,073 edits →‎Equipment performance and process related parameters ← Older edit		Revision as of 10:54, 29 November 2018 view source Rkch (talk \| contribs) DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers 265 edits →‎Polisher/Lapper Newer edit →
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	[[image:Logitech pm5 1.jpg\|400px\|right\|thumb\|The Logitech PM5 Polisher/Lapper]]		[[image:Logitech pm5 1.jpg\|400px\|right\|thumb\|The Logitech PM5 Polisher/Lapper]]

	The Logitech ~~PM5~~ Polisher~~/Lapper~~ is for thinning down wafers ~~and~~ other substrates.		The Logitech Orbis Polisher (CMP) is for polishing wafers (removing material in the nm range) it is not for thinning down wafers or other substrates.