Specific Process Knowledge/Thin film deposition: Difference between revisions
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*[[/Sputter coater#The_Hummer_Sputter_coater|Sputter coater Hummer]] - ''Gold sputtering system'' | *[[/Sputter coater#The_Hummer_Sputter_coater|Sputter coater Hummer]] - ''Gold sputtering system'' | ||
*[[/Sputter coater#The_Balzer_Sputter_coater|Balzer Sputter coater]] - ''Gold sputtering system'' | *[[/Sputter coater#The_Balzer_Sputter_coater|Balzer Sputter coater]] - ''Gold sputtering system'' | ||
*[[/Sputter coater#Sputter_coater 03|Sputter coater 03]] - ''Gold sputtering system'' | |||
*[[/III-V Dielectric evaporator|III-V Dielectric evaporator]] - ''E-beam evaporation tool'' | *[[/III-V Dielectric evaporator|III-V Dielectric evaporator]] - ''E-beam evaporation tool'' | ||
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Revision as of 10:20, 26 September 2016
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Choose material to deposit
Dielectrica | Semicondutors | Metals | Alloys | Transparent conductive oxides | Polymers |
Silicon Nitride - and oxynitride |
Aluminium |
TiW alloy (10%/90% by weight) |
SU-8 |
Choose deposition equipment
PVD | LPCVD | PECVD | ALD | Coaters | Others
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See the Lithography/Coaters page for coating polymers |
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