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Specific Process Knowledge/Thin film deposition/Deposition of Silicon Oxide: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
912 edits
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At DANCHIP you can also deposit silicon oxide using [[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]], [[Specific Process Knowledge/Thin film deposition/Multisource PVD|PVD co-sputter/evaporation]] or [[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE Ionfab300]]
At DANCHIP you can also deposit silicon oxide using [[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]], [[Specific Process Knowledge/Thin film deposition/Multisource PVD|PVD co-sputter/evaporation]] or [[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE Ionfab300]]
sputter systems. One of the advantages here is that you can deposit on any material you like.
sputter systems. One of the advantages here is that you can deposit on any material you like.
*[[Specific Process Knowledge/Thin film deposition/Deposition of Silicon oxide in PVD co-sputter/evaporation|Deposition of Silicon Oxide using PVD co-sputter/evaporation tool]]


*[[/Deposition of Silicon Oxide using Lesker sputter tool|Deposition of Silicon Oxide using Lesker sputter tool]]
*[[/Deposition of Silicon Oxide using Lesker sputter tool|Deposition of Silicon Oxide using Lesker sputter tool]]
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