Specific Process Knowledge/Etch/Etching of Bulk Glass: Difference between revisions
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* Piranha clean | * Piranha clean | ||
* Bake-out at 250 C (>2 | * Bake-out at 250 C (>2.5 hours) | ||
* Plasma ashing | * Plasma ashing | ||
* Sputter-deposit in Alcatel: Power: 550W, Ar-pressure: 10<math>^{-2}</math> mbar (base pressure: 10<math>^{-6}</math> mbar) | * Sputter-deposit in Alcatel: Power: 550W, Ar-pressure: 10<math>^{-2}</math> mbar (base pressure: 10<math>^{-6}</math> mbar) | ||