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| Line 269: |
Line 269: |
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| 7. Nitrogen purge, 3.5 min | | 7. Nitrogen purge, 3.5 min |
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| ===Equipment performance and process related parameters===
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| {| border="2" cellspacing="0" cellpadding="2"
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|
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| !style="background:silver; color:black;" align="center" width="60"|Purpose
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| |style="background:LightGrey; color:black"|
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| |style="background:WhiteSmoke; color:black" align="center"|
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| Promotion of photoresist adhesion
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|
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| by hydrophobization
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| |-
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| !style="background:silver; color:black;" align="center" width="60"|Chemical
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| |style="background:LightGrey; color:black"|
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| |style="background:WhiteSmoke; color:black" align="center"|
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| hexamethyldisilizane
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| |-
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| !style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance
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| |style="background:LightGrey; color:black"|Contact angle
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| |style="background:WhiteSmoke; color:black" align="center"|
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| 82° (on SiO<sub>2</sub>)
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| |-
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| !style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameters
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| |style="background:LightGrey; color:black"|Process temperature
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| |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
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| 150 °C
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| |-
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| |style="background:LightGrey; color:black"|Process time
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| |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
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| 32.5 minutes
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| |-
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| !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
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| |style="background:LightGrey; color:black"|Substrate size
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| |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
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| * 50 mm wafers
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| * 100 mm wafers
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| * 150 mm wafers
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| |-
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| | style="background:LightGrey; color:black"|Allowed materials
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| |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
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| Silicon, glass, and polymer substrates
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| Film or pattern of all but Type IV and resist/polymer
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| |-
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| |style="background:LightGrey; color:black"|Batch
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| |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
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| 1 - 25, multiple batches possible
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| |-
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| |}
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| <br clear="all" />
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| ==Oven: HMDS 2== | | ==Oven: HMDS 2== |
