Specific Process Knowledge/Lithography/Pretreatment: Difference between revisions
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150°C | 150°C | ||
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150°C | |||
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50°C | 50°C | ||
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120°C | |||
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32.5 minutes | 32.5 minutes | ||
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25 minutes | |||
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3 min / wafer | 3 min / wafer | ||
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1 min / wafer | |||
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| Line 203: | Line 203: | ||
* 100 mm wafers | * 100 mm wafers | ||
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* 50 mm wafers (tool change required) | |||
* 100 mm wafers | * 100 mm wafers | ||
* 150 mm wafers | * 150 mm wafers | ||
* 200 mm wafers (tool change required) | |||
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