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Specific Process Knowledge/Lithography/Pretreatment: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
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Jehem (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
1,871 edits
Line 139: Line 139:
Coming soon:
Coming soon:
* Si (native oxide): xx°
* Si (native oxide): xx°
* SiO2 (100 nm): xx°
* SiO<sub>2</sub> (110 nm): xx°
* Boron Glass: xx°
* Boron Glass: xx°
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|
Line 145: Line 145:
Coming soon:
Coming soon:
* Si (native oxide): xx°
* Si (native oxide): xx°
* SiO2 (100 nm): xx°
* SiO<sub>2</sub> (110 nm): xx°
* Boron Glass: xx°
* Boron Glass: xx°


Line 153: Line 153:
Coming soon:
Coming soon:
* Si (native oxide): xx°
* Si (native oxide): xx°
* SiO2 (100 nm): xx°
* SiO<sub>2</sub> (110 nm): xx°
* Boron Glass: xx°
* Boron Glass: xx°
|
|
Line 159: Line 159:
Coming soon:
Coming soon:
* Si (native oxide): xx°
* Si (native oxide): xx°
* SiO2 (100 nm): xx°
* SiO<sub>2</sub> (110 nm): xx°
* Boron Glass: xx°
* Boron Glass: xx°
|-
|-
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