Jump to content

Specific Process Knowledge/Lithography/Pretreatment: Difference between revisions

Jehem (talk | contribs)
Jehem (talk | contribs)
Line 111: Line 111:
|style="background:LightGrey; color:black"|
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* HMDS priming
* HMDS priming only
|
|
* HMDS priming only
* HMDS priming only
Line 136: Line 136:
|style="background:WhiteSmoke; color:black" align="center"|
|style="background:WhiteSmoke; color:black" align="center"|
standard recipe 82° (on SiO<sub>2</sub>)
standard recipe 82° (on SiO<sub>2</sub>)
Coming soon:
* Si (native oxide): xx°
* SiO2 (100 nm): xx°
* Boron Glass: xx°
|
|
Coming soon:
* Si (native oxide): xx°
* SiO2 (100 nm): xx°
* Boron Glass: xx°
|style="background:WhiteSmoke; color:black" align="center"|
|style="background:WhiteSmoke; color:black" align="center"|
60° - 90°; standard recipe 82° (on SiO<sub>2</sub>)
60° - 90°; standard recipe 82° (on SiO<sub>2</sub>)
Coming soon:
* Si (native oxide): xx°
* SiO2 (100 nm): xx°
* Boron Glass: xx°
|
|
Coming soon:
* Si (native oxide): xx°
* SiO2 (100 nm): xx°
* Boron Glass: xx°
|-
|-