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Specific Process Knowledge/Lithography/Baking: Difference between revisions

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Jehem (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
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==Hotplate: 90-110C==   
==Hotplate: 90-110C==   
[[Image:Hotplate90-110C in C-1.jpg|300x300px|thumb|Location of Hotplate: 90-110C in C-1]]
[[Image:Hotplate90-110C in C-1.jpg|300x300px|thumb|Hotplate: 90-110C located in C-1]]
Hotplate: 90-110C is used for baking of 2" - 6" wafers. Do not exceed 120°C.
Hotplate: 90-110C is used for baking of 2" - 6" wafers. Do not exceed 120°C.


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