Specific Process Knowledge/Characterization: Difference between revisions
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*[[/SEM Supra 2|SEM Supra 2]] | *[[/SEM Supra 2|SEM Supra 2]] | ||
*[[/SEM Supra 3|SEM Supra 3]] | *[[/SEM Supra 3|SEM Supra 3]] | ||
*[[/SEM Tabletop 1|SEM Tabletop 1]] | |||
'''TEM's at CEN''' | '''TEM's at CEN''' | ||
Revision as of 11:09, 23 January 2017
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Choose characterization topic
- Element analysis
- Measurement of film thickness and optical constants
- Photoluminescence mapping
- Sample imaging
- Sample preparation for inspection
- Stress measurement
- Wafer thickness measurement
- Topographic measurement
- Contact angle measurement
- Four-Point Probe (Resistivity measurement)
- Carrier density (doping) profiler
- Scanning Electron Microscopy
Choose equipment
AFM
Element analysis
Optical and stylus profilers
Optical microscopes
Optical characterization
- Ellipsometer
- Filmtek 4000
- Prism Coupler
- PL mapper - Photoluminescence mapper
- Lifetime scanner MDPmap
SEM's at CEN
- FIB-SEM FEI QUANTA 200 3D
- Dual Beam FEI Helios Nanolab 600
- SEM FEI Nova 600 NanoSEM
- SEM FEI Quanta 200 ESEM FEG
- SEM Inspect S
SEM's at Danchip
TEM's at CEN
Various