Specific Process Knowledge/Bonding/Anodic bonding: Difference between revisions
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===Bonding procedure=== | ===Bonding procedure=== | ||
*If the wafers are to be | *If the wafers are to be aligned remember to put the Si wafers in first (Si wafer closest to the chuck). | ||
*If the wafers are just | *If the wafers are just stacked on top of each other remember to put the Si below (Si wafer closest to the chuck). | ||
*Align the wafers | *Align the wafers | ||
*Place the chuck and graphite electrode in the chamber. | *Place the chuck and graphite electrode in the chamber. | ||
*Close the chamber. | *Close the chamber. | ||
*Turn the µm screw on top of the chamber to set the desired stack height. | *Turn the µm screw on top of the chamber to set the desired stack height. | ||