Specific Process Knowledge/Lithography/EBeamLithography/JBX9500Manual: Difference between revisions
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Wafer cassettes must be handled with great care and with an extra pair of clean gloves (to be found inside the e-beam room). Prevent any form of impact of the cassette and never touch the delicate parts of the cassette, i.e. the reference plane, reference marks or grounding pins. Take care that the cassette is not scratched against the metal table, always keep cleanroom side-sealed lintfree tissues between cassette and table. | Wafer cassettes must be handled with great care and with an extra pair of clean gloves (to be found inside the e-beam room). Prevent any form of impact of the cassette and never touch the delicate parts of the cassette, i.e. the reference plane, reference marks or grounding pins. Take care that the cassette is not scratched against the metal table, always keep cleanroom side-sealed lintfree tissues between cassette and table. | ||
[[File:HowToMount.jpg|right|600px]] | |||
General rules for handling cassettes and mounting wafers and chips into cassettes: | General rules for handling cassettes and mounting wafers and chips into cassettes: | ||
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Seen from the front-side of the cassette with the hook to the right, the workpiece windows (wafer positions) are named A, B, C etc in reading-direction from top left to bottom right. | Seen from the front-side of the cassette with the hook to the right, the workpiece windows (wafer positions) are named A, B, C etc in reading-direction from top left to bottom right. | ||
= Optical pre-alignment of wafers = | = Optical pre-alignment of wafers = | ||