Specific Process Knowledge/Bonding/Fusion bonding: Difference between revisions

Revision as of 10:09, 13 March 2008 view source Rkc (talk \| contribs) danchip 123 edits No edit summary ← Older edit		Revision as of 10:13, 13 March 2008 view source Rkc (talk \| contribs) danchip 123 edits No edit summary Newer edit →
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	===Bonding procedure===		===Bonding procedure===

	*Clean the wafers with IMEC clean		*Clean the wafers with [[Specific Process Knowledge/Wafer cleaning/IMEC\|IMEC]] clean.