Specific Process Knowledge/Lithography/EBeamLithography/JBX9500Manual: Difference between revisions
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| [[File:IMG_0239.jpg| | | [[File:IMG_0239.jpg|190px]] [[File:IMG_6675.jpg|190px]] | ||
|[[File:IMG_6440.jpg| | |[[File:IMG_6440.jpg|190px]] [[File:IMG_6441.jpg|190px]] | ||
| [[File:IMG_6433.jpg| | | [[File:IMG_6433.jpg|190px]] [[File:IMG_6434.jpg|190px]] | ||
| [[File: | | [[File:4inchTi.jpg|190px]] [[File:IMG_6437.jpg|190px]] | ||
|[[File:4inchAl.jpg| | |[[File:4inchAl.jpg|190px]] [[File:IMG_6439.jpg|190px]] | ||
|- align="center" | |- align="center" | ||
| chip Al/Cu cassette and a close-up of slot 3B (12 mm) || 2" Ti cassette; wafer orientation is flat-down || 2" Al cassette; wafer orientation is flat-up || 4" Ti cassette; wafer orientation is flat-down || 4" Al cassette; wafer orientation is flat-down | | chip Al/Cu cassette and a close-up of slot 3B (12 mm) || 2" Ti cassette; wafer orientation is flat-down || 2" Al cassette; wafer orientation is flat-up || 4" Ti cassette; wafer orientation is flat-down || 4" Al cassette; wafer orientation is flat-down | ||