Jump to content

Specific Process Knowledge/Thin film deposition/Deposition of Silicon: Difference between revisions

← Older editNewer edit →
VisualWikitext
BGE (talk | contribs)
Bureaucrats, danchip, Administrators
2,908 edits
No edit summary
BGE (talk | contribs)
Bureaucrats, danchip, Administrators
2,908 edits
No edit summary
Line 39: Line 39:
|Adhesion
|Adhesion
|Bad for pyrex, for other materials we do not know
|Bad for pyrex, for other materials we do not know
|Good for quartz, silicon oxide, silicon nitride, silicon
|Good for fused silica, silicon oxide, silicon nitride, silicon
|-
|-
|Substrate material allowed
|Substrate material allowed
|Pyrex, Quartz, Silicon, metals, oxide, nitride, blue tape
|Pyrex, fused silica, silicon, metals, oxide, nitride, blue tape
|Quartz, Silicon, oxide, nitride
|Fused silica, Silicon, oxide, nitride
|-
|-
|Doping facility
|Doping facility
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Silicon"