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| == Process Flow ==
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| {|border="1" cellspacing="0" cellpadding="3" align="left" style="text-align:left;" style="width: 80%;"
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| |-style="background:Black; color:White"
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| !Equipment
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| !Process Parameters
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| !Comments
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| |-style="background:White; color:black; text-align:center"
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| !colspan="4"|Pretreatment
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| |-style="background:LightGrey; color:black"
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| |4" Si wafers
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| |No Pretreatment
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| |-style="background:White; color:black; text-align:center"
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| !colspan="4"|Spin Coat
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| |-style="background:LightGrey; color:black"
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| |Spin Coater Manual, LabSpin, A-5
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| |AR-P 6200/2 AllResist E-beam resist
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| 60 sec at various spin speed.
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| Acceleration 4000 s-2,
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| softbake 1 - 5 min at 150 deg Celcius
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| |Disposal pipette used; clean by N2-gun before use. Use approximately 1.5 ml per 4" wafer, never use a pipette twice. Softbake is not a crucial step, see e-mail correspondence with AllResist [[media:Softbake CSAR.pdf|here]].
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| |-style="background:White; color:black; text-align:center"
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| !colspan="4"|Characterization
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| |-style="background:LightGrey; color:black"
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| |Ellipsometer VASE B-1
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| |9 points measured on 100 mm wafer
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| |ZEP program used; measured at 70 deg only
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| |-style="background:White; color:black; text-align:center"
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| !colspan="4"|E-beam Exposure
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| |-style="background:LightGrey; color:black"
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| |JEOL 9500 E-beam writer, E-1
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| |Dosepattern 15nm - 100nm,
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| dose 120-350 muC/cm2
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| |Virtual chip mark height detection (CHIPAL V1) used in corner of every dose array
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| |-style="background:White; color:black; text-align:center"
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| !colspan="4"|Development
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| |-style="background:LightGrey; color:black"
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| |Fumehood, D-3
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| |60 sec in X AR 600-546,
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| 60 sec rinse in IPA,
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| N2 Blow dry
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| |Gentle agitation while developing. After developing, wafer is immersed in beaker with IPA, subsequently blow dried with N2 gun.
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| |-style="background:White; color:black; text-align:center"
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| !colspan="4"|Characterization
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| |-style="background:LightGrey; color:black"
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| |Zeiss SEM Supra 60VP, D-3
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| |2-3 kV, shortest working distance possible, chip mounted with Al tape
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| |For dosepattern SEM inspection: the wafers are diced into smaller pieces and sputter coated with Pt at DTU CEN before SEM inspection; please contact [mailto:ramona.mateiu@cen.dtu.dk Ramona Valentina Mateiu] for further information.
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| |}
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