Specific Process Knowledge/Etch/DRIE-Pegasus/processA/PrA-2: Difference between revisions

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Revision as of 13:03, 16 June 2016


Process runs
Date Substrate Information Process Information SEM Images
Wafer info Exposed area Conditioning Recipe Wafer ID
2/5-2016 4" Travka20 Wafer 20 % Si 3 minute TDESC clean PrA-2, 80 cycles or 14:40 minutes C03991.03

2/5-2016 4" Travka20 Wafer 20 % Si 3 minute TDESC clean PrA-2, 80 cycles or 14:40 minutes C03991.06

3/6-2016 4" Travka20 Wafer 20 % Si 3 minute TDESC clean PrA-2, 80 cycles or 14:40 minutes C04047.03

3/6-2016 4" Travka20 Wafer 20 % Si 3 minute TDESC clean PrA-2, 80 cycles or 14:40 minutes C04047.06

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