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Specific Process Knowledge/Etch/Etching of Bulk Glass: Difference between revisions

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Bureaucrats, danchip, Administrators
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Fj (talk | contribs)
Bureaucrats, danchip, Administrators
143 edits
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|'''Batch size'''
|'''Batch size'''
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*1-25 wafers at a time
*1 wafers at a time
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*1 wafer at a time
*1 wafer at a time
Line 64: Line 64:
*4" wafers
*4" wafers
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*4" wafers or smaller pieces
*4" wafers
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|-valign="top"
|-valign="top"
|'''Allowed materials'''
|'''Allowed materials'''
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*Silicon
*No restrictions
*Silicon Oxide
*Silicon Nitride
*Silicon Oxynitride
*Photoresist
*Blue film
*Gold (Au) and Nickel (Ni) (but only in BHF2 (KOH)!)
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*Silicon
*No restrictions
*Silicon Oxide
*Silicon Nitride
*Silicon Oxynitride
*Photoresist
*E-beam resist
*Aluminium
*Chromium (ONLY RIE2!)
*Other metals that covers less the 5% of the wafer area (ONLY RIE2!)
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|-
|-
|}
|}
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