Specific Process Knowledge/Etch/Etching of Bulk Glass: Difference between revisions
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Masking materials and pre-treatment of the glass surface prior to the deposition of the masking material is a special concern in particular for deep etchings (> 10µm). | Masking materials and pre-treatment of the glass surface prior to the deposition of the masking material is a special concern in particular for deep etchings (> 10µm). | ||
Due to the high cleanliness fused silica is allowed access to basically all machines meaning that e.g. LPCVD silicon can be deposited as masking material. This is an excellent mask even for quite deep etchings. | Due to the high cleanliness fused silica is allowed access to basically all machines meaning that e.g. LPCVD silicon can be deposited as masking material. This is an excellent mask even for quite deep etchings. | ||
Regarding borosilicate glass masking is more tricky. The follwing sequence has been used with some success (using sputtered silicon from the Alcatel): | |||
40% HF 3µm/min | 40% HF 3µm/min | ||
Beaker | Beaker | ||