Specific Process Knowledge/Etch/DRIE-Pegasus/DUVetch/polySOI10: Difference between revisions

Revision as of 10:53, 2 June 2016

**Process runs**
Date	Substrate Information				Process Information				SEM Images
Date	Wafer info	Mask	Material/ Exposed area	Tool / Operator	Conditioning	Recipe	Wafer ID	Comments	SEM Images
6/5-2013	1/4 1/4 6" ELK stitching 11/1-2013 CB on oxide carrier	standard stepper mask (50 nm barc + 320 nm krf)	Si / 50%+	Pegasus / jmli	3min TDESC clean + 30 sec barc etch	polySOI5 , 50 cycles or 6:15 minutes	S003472
16/7-2013	1/4 6" ELK stitching 11/1-2013 CB on oxide carrier	standard stepper mask (50 nm barc + 320 nm krf)	Si / 50%+	Pegasus/jmli	3 minute TDESC clean + 30 second barc etch	jml/SOI3/polySOI-10: 50 cycles or 6:15 minutes	S003614	lsh: c4f8 etch -> 20
23/8-2013	1/4 6" tigre 400 nm pitch pattern CB on oxide carrier	standard stepper mask (50 nm barc + 320 nm krf)	Si / 50 % in 20*20 mm squares	Pegasus / jmli	10 minute TDESC clean + 30 second barc etch	jml/SOI3/polySOI-10: 100 cycles or 12:30 minutes	S003695
15/5-2014	6" DUV Lithography test pattern	standard stepper mask (50 nm barc + 320 nm krf)	Si / 50 % in 20*20 mm squares	Pegasus / jmli	10 minute TDESC clean + 30 second barc etch	jml/SOI3/polySOI-10: 50 cycles or 6:15 minutes + 2 mins gentle PR strip	S004031
28/8-2014	6" DUVboxA wafer	standard stepper mask (50 nm barc + 320 nm krf)	Si / 50%+	Pegasus / jmli	30 sec barc etch	SOI4\polySOI-10 , 70 cycles or 8:45 minutes	S004289
28/8-2014	6" DUVboxB wafer	Si/200nm Oxide/1800 nm poly / standard stepper mask (50 nm barc + 320 nm krf)	poly / 50%+	Pegasus / jmli	75 sec barc etch	SOI4\polySOI-10 , 20 cycles or 2:30 minutes	S004289
28/8-2014	6" DUVboxB wafer	Si/200nm Oxide/1800 nm poly / standard stepper mask (50 nm barc + 320 nm krf)	poly / 50%+	Pegasus / jmli	0 sec barc etch	SOI4\polySOI-10 , 30 + 10 cycles or 5:00 minutes	S004291 (two processes)	S004289 reprocessed, probably overetched -> no spikes

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-|-
-! colspan="10" | [[Main Page/Process Logs/jmli/Pegasus/SOI/polySOI10-b | Later runs of this recipe]]
-|-
-|}
-{| border="2" cellpadding="0" cellspacing="0" style="text-align:center;"
-|+ '''Process runs'''
-|-
-! rowspan="2" width="40"| Date
-! colspan="4" width="120"| Substrate Information
-! colspan="4" | Process Information
-! rowspan="2" width="500" |SEM Images
-|-
-! width="30" | Wafer info
-! width="40" | Mask
-! width="40" | Material/ Exposed area
-! width="40" | Tool / Operator
-! width="40" | Conditioning
-! width="40" | Recipe
-! width="40" | Wafer ID
-! width="40" | Comments
 |-
 | 28/8-2014