Specific Process Knowledge/Bonding: Difference between revisions
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|'''Materials possible to bond''' | |'''Materials possible to bond''' | ||
|Bonding of | |Bonding of substrates is done by use of the eutectica Au/Si, Au/Sn and Ni/Si | ||
|Si/Si, SiO<math>_2</math>/SiO<math>_2</math> | |Si/Si, SiO<math>_2</math>/SiO<math>_2</math> | ||
|Si/Pyrex (glass) | |Si/Pyrex (glass) | ||