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Specific Process Knowledge/Bonding: Difference between revisions

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|No annealing
|No annealing
|-valign="top"
|-valign="top"
|'''Max. scan range z'''
|'''Materials possible to bond'''
|<100Å to~0.3mm
|Au/Si , Au/Sn, Ni/Si
|50Å to 262µm
|Si/Si, SiO<math>_2</math>/SiO<math>_2</math>
|1 µm (can go up to 5 µm under special settings)
|Si/Pyrex (glass)
|-valign="top"
|-valign="top"
|'''Resolution xy'''
|'''Substrate size'''
|up to 5900 data points per profile
|Up to 6"
|down to 0.067 µm
|Up to 6"
|Depending on scan size and number of samples per line and number of lines - accuracy better than 2%
|Up to 6"
|-valign="top"
|-valign="top"
|'''Resolution z'''
|'''Resolution z'''
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