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Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange: Difference between revisions

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Jmli (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
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| [[file:S004679 edge.jpg |250px|frameless ]]
| [[file:S004679 edge.jpg |250px|frameless ]]
|-
|-
! width="100"| Continuous isotropic silicon etch called isoslow7
| width="100"| 1 minute, 10 degrees, 10 mTorr, 80 SF<sub>6</sub>, 150 W coil, 3 W platen
| S003900
| 4" wafer, 50 % load
|
[[file:S003900-01.jpg |120px|frameless ]]
[[file:S003900-02.jpg |120px|frameless ]]
[[file:S003900-03.jpg |120px|frameless ]]
[[file:S003900-04.jpg |120px|frameless ]]
[[file:S003900-05.jpg |120px|frameless ]]
[[file:S003900-06.jpg |120px|frameless ]]


| S00XXX
| No test yet
| [[file:S00XX centre.jpg |250px|frameless ]]
|-
|}
|}


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