Specific Process Knowledge/Lithography/DUVStepperLithography: Difference between revisions
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===Standard processes=== | ===Standard processes=== | ||
Post-exposure bake: | |||
*'''(1000) DCH PEB 130C 60s''' 60s baking at 130°C | *'''(1000) DCH PEB 130C 60s''' 60s baking at 130°C | ||
*'''(1001) DCH PEB 130C 90s''' 90s baking at 130°C | *'''(1001) DCH PEB 130C 90s''' 90s baking at 130°C | ||
Development: | |||
*'''(1004) DCH DEV 60s''' 60s single puddle development | |||
PEB and development: | |||
*'''(1002) DCH PEB_60s and DEV_60s''' 60s baking at 130°C followed by 60s single puddle development | *'''(1002) DCH PEB_60s and DEV_60s''' 60s baking at 130°C followed by 60s single puddle development | ||
*'''(1003) DCH PEB_90s and DEV_60s''' 90s baking at 130°C followed by 60s single puddle development | *'''(1003) DCH PEB_90s and DEV_60s''' 90s baking at 130°C followed by 60s single puddle development | ||
The standard developer process consists of: | The standard developer process consists of: | ||