Specific Process Knowledge/Lithography/DUVStepperLithography: Difference between revisions
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*Negative DUV resist for spinning in 1400-800nm or diluted with EC Solvent in 1:1 in 400-200nm thickness range [[Media:UVN2300.pdf|UVN2300-0.8]]. | *Negative DUV resist for spinning in 1400-800nm or diluted with EC Solvent in 1:1 in 400-200nm thickness range [[Media:UVN2300.pdf|UVN2300-0.8]]. | ||
===Standard processes=== | |||
BARC DUV42S-6: | BARC DUV42S-6: | ||