Specific Process Knowledge/Lithography/DUVStepperLithography: Difference between revisions
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*'''(1003) DCH PEB_90s and DEV_60s''' 90s baking at 130°C followed by 60s single puddle development | *'''(1003) DCH PEB_90s and DEV_60s''' 90s baking at 130°C followed by 60s single puddle development | ||
*'''(1004) DCH DEV 60s''' 60s single puddle development | *'''(1004) DCH DEV 60s''' 60s single puddle development | ||
The standard developer process consists of: | |||
*pre-wetting with water (2.5s @ 1000rpm) | |||
*developer dispense (2.5s @ 40rpm, corresponding to ~9ml) | |||
*development (60s @ 0rpm) | |||
*water rinse with BSR (5s @ 3000rpm) | |||
*nitrogen drying (7s @ 4000rpm) | |||
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