Specific Process Knowledge/Lithography/DUVStepperLithography: Difference between revisions
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*Positive DUV resist for spinning in 1600-800nm thickness range [[Media:M35G_Danchip_intro.pdf|KRF M35G]]. | *Positive DUV resist for spinning in 1600-800nm thickness range [[Media:M35G_Danchip_intro.pdf|KRF M35G]]. | ||
*Negative DUV resist for spinning in 1400-800nm or diluted with EC Solvent in 1:1 in 400-200nm thickness range [[Media:UVN2300.pdf|UVN2300-0.8]]. | *Negative DUV resist for spinning in 1400-800nm or diluted with EC Solvent in 1:1 in 400-200nm thickness range [[Media:UVN2300.pdf|UVN2300-0.8]]. | ||
'''Standard processes:''' | |||
*DCH... | |||
== Equipment performance and process related parameters == | == Equipment performance and process related parameters == | ||