Specific Process Knowledge/Wafer cleaning/RCA: Difference between revisions
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|'''Chemical solution''' | |'''Chemical solution''' | ||
|H<math>_2</math>O, NH<math>_4</math>OH(29%) and H<math>_2</math>O<math>_2</math>(30%) (5:1:1) | |H<math>_2</math>O, NH<math>_4</math>OH(25-29%) and H<math>_2</math>O<math>_2</math>(30%) (5:1:1) | ||
|H<math>_2</math>O, HCl(37%) and H<math>_2</math>O<math>_2</math>(30%) (5:1:1) | |H<math>_2</math>O, HCl(37%) and H<math>_2</math>O<math>_2</math>(30%) (5:1:1) | ||
|5% HF | |5% HF | ||